dc.contributor.author | Cauwe, Maarten | |
dc.contributor.author | Vandevelde, Bart | |
dc.contributor.author | Nawghane, Chinmay | |
dc.contributor.author | Van de Slyeke, Marnix | |
dc.contributor.author | Coulon, Alexia | |
dc.contributor.author | Heltzel, Stan | |
dc.date.accessioned | 2023-08-02T09:23:25Z | |
dc.date.available | 2023-06-20T10:36:49Z | |
dc.date.available | 2023-08-02T09:23:25Z | |
dc.date.issued | 2023 | |
dc.identifier.issn | 1868-2502 | |
dc.identifier.other | WOS:000722108500002 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/41960.2 | |
dc.source | WOS | |
dc.title | Challenges in introducing high-density interconnect technology in printed circuit boards for space applications | |
dc.type | Journal article | |
dc.contributor.imecauthor | Cauwe, Maarten | |
dc.contributor.imecauthor | Vandevelde, Bart | |
dc.contributor.imecauthor | Nawghane, Chinmay | |
dc.contributor.orcidimec | Cauwe, Maarten::0000-0002-6413-998X | |
dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
dc.contributor.orcidimec | Nawghane, Chinmay::0000-0002-1867-827X | |
dc.date.embargo | 2023-07-31 | |
dc.identifier.doi | 10.1007/s12567-021-00403-2 | |
dc.source.numberofpages | 12 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 101 | |
dc.source.endpage | 112 | |
dc.source.journal | CEAS SPACE JOURNAL | |
dc.source.issue | 1 | |
dc.source.volume | 15 | |
imec.availability | Published - open access | |
dc.description.wosFundingText | The work in this paper is performed in the frame of an ESA GSTP project (ESA Contract No.: 4000122931/18/NL/LvH). The authors would like to thank Jason Furlong from PWB Interconnect Solutions and all members of the ESA PCB/SMT working group for their valuable insights and feedback. | |