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Board-level solder intermetallic strength measurements using mini-Charpy shock testing and FEM calibration
Publication:
Board-level solder intermetallic strength measurements using mini-Charpy shock testing and FEM calibration
Date
2018
Proceedings Paper
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39789.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Labie, Riet
;
Duflos, Frederic
;
Vandevelde, Bart
;
Allaert, Bart
;
Lauwaert, Ralph
;
Willems, Geert
Journal
Abstract
Description
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1957
since deposited on 2021-10-25
Acq. date: 2025-10-27
Citations
Metrics
Views
1957
since deposited on 2021-10-25
Acq. date: 2025-10-27
Citations