Authors

Labie, Riet; Duflos, Frederic; Vandevelde, Bart; Allaert, Bart; Lauwaert, Ralph; Willems, Geert

Conference

19th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics & Microsysystems - EuroSimE

Title

Board-level solder intermetallic strength measurements using mini-Charpy shock testing and FEM calibration

Publication type

Proceedings paper

Embargo date

9999-12-31