Publication:

Board-level solder intermetallic strength measurements using mini-Charpy shock testing and FEM calibration

Date

2018
Proceedings Paper
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dc.contributor.authorLabie, Riet
dc.contributor.authorDuflos, Frederic
dc.contributor.authorVandevelde, Bart
dc.contributor.authorAllaert, Bart
dc.contributor.authorLauwaert, Ralph
dc.contributor.authorWillems, Geert
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorWillems, Geert
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecWillems, Geert::0000-0002-9137-618X
dc.date.accessioned2021-10-25T21:23:57Z
dc.date.available2021-10-25T21:23:57Z
dc.date.embargo9999-12-31
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31102
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8369920
dc.source.beginpage1
dc.source.conference19th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics & Microsysystems - EuroSimE
dc.source.conferencedate16/04/2018
dc.source.conferencelocationToulouse France
dc.source.endpage6
dc.title

Board-level solder intermetallic strength measurements using mini-Charpy shock testing and FEM calibration

dc.typeProceedings paper
dspace.entity.typePublication
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