Authors

Vandevelde, Bart; Van Kerckhove, Matthias; Degryse, Dominiek; D'Haese, Wim; Schaubroeck, David; Allaert, Bart; Geerinckx, Eddy; Lauwaert, Ralph; Willems, Geert

Conference

European Microelectronics and Packaging Conference - EMPC

Title

Impact of pad finish on mechanical shock resistance of lead-free solder joints tested under shear and in pull mode

Publication type

Proceedings paper