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Impact of pad finish on mechanical shock resistance of lead-free solder joints tested under shear and in pull mode
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Impact of pad finish on mechanical shock resistance of lead-free solder joints tested under shear and in pull mode
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Date
2013
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vandevelde, Bart
;
Van Kerckhove, Matthias
;
Degryse, Dominiek
;
D'Haese, Wim
;
Schaubroeck, David
;
Allaert, Bart
;
Geerinckx, Eddy
;
Lauwaert, Ralph
;
Willems, Geert
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1900
since deposited on 2021-10-21
Acq. date: 2025-12-10
Citations
Metrics
Views
1900
since deposited on 2021-10-21
Acq. date: 2025-12-10
Citations