Publication:
Impact of pad finish on mechanical shock resistance of lead-free solder joints tested under shear and in pull mode
Date
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.author | Van Kerckhove, Matthias | |
| dc.contributor.author | Degryse, Dominiek | |
| dc.contributor.author | D'Haese, Wim | |
| dc.contributor.author | Schaubroeck, David | |
| dc.contributor.author | Allaert, Bart | |
| dc.contributor.author | Geerinckx, Eddy | |
| dc.contributor.author | Lauwaert, Ralph | |
| dc.contributor.author | Willems, Geert | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.imecauthor | Schaubroeck, David | |
| dc.contributor.imecauthor | Willems, Geert | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.contributor.orcidimec | Willems, Geert::0000-0002-9137-618X | |
| dc.date.accessioned | 2021-10-21T13:44:45Z | |
| dc.date.available | 2021-10-21T13:44:45Z | |
| dc.date.issued | 2013 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/23293 | |
| dc.source.conference | European Microelectronics and Packaging Conference - EMPC | |
| dc.source.conferencedate | 9/09/2013 | |
| dc.source.conferencelocation | Grenoble France | |
| dc.title | Impact of pad finish on mechanical shock resistance of lead-free solder joints tested under shear and in pull mode | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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