Publication:
Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components
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2104 since deposited on 2021-10-24
6last month
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Acq. date: 2026-08-05
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Statistics
Views
2104 since deposited on 2021-10-24
6last month
3last week
Acq. date: 2026-08-05
Citations