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Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components
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Authors
Vandevelde, Bart
;
Vanhee, Filip
;
Pissoort, Davy
;
Degrendele, Lieven
;
De Baets, Johan
;
Allaert, Bart
;
Lauwaert, Ralph
;
Zanon, Franco
;
Labie, Riet
;
Willems, Geert
ISSN
0026-2714
Journal
Microelectronics Reliability
Volume
74
Title
Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components
Publication type
Journal article
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