Publication:

Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components

Date

2017
Journal article
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dc.contributor.authorVandevelde, Bart
dc.contributor.authorVanhee, Filip
dc.contributor.authorPissoort, Davy
dc.contributor.authorDegrendele, Lieven
dc.contributor.authorDe Baets, Johan
dc.contributor.authorAllaert, Bart
dc.contributor.authorLauwaert, Ralph
dc.contributor.authorZanon, Franco
dc.contributor.authorLabie, Riet
dc.contributor.authorWillems, Geert
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorDegrendele, Lieven
dc.contributor.imecauthorDe Baets, Johan
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorWillems, Geert
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecWillems, Geert::0000-0002-9137-618X
dc.date.accessioned2021-10-24T17:00:25Z
dc.date.available2021-10-24T17:00:25Z
dc.date.issued2017
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/29764
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S0026271417300987
dc.source.beginpage131
dc.source.endpage135
dc.source.journalMicroelectronics Reliability
dc.source.volume74
dc.title

Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components

dc.typeJournal article
dspace.entity.typePublication
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