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Investigation of solder joint deformation under thermo-mechanical loading using DIC techniques
Publication:
Investigation of solder joint deformation under thermo-mechanical loading using DIC techniques
Date
2020
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Eichhorst, Michael
;
Seiler, B.
;
Scheiter, L.
;
Vandevelde, Bart
;
Lauwaert, Ralph
Journal
Abstract
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1941
since deposited on 2021-10-28
Acq. date: 2025-10-27
Citations
Metrics
Views
1941
since deposited on 2021-10-28
Acq. date: 2025-10-27
Citations