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How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance
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Authors
Vandevelde, Bart
;
Degrendele, Lieven
;
Cauwe, Maarten
;
Allaert, Bart
;
Lauwaert, Ralph
;
Willems, Geert
Conference
International Conference on Electronics Packaging - ICEP
Title
How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance
Publication type
Proceedings paper
Embargo date
9999-12-31
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