How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance

dc.contributor.author	Vandevelde, Bart
dc.contributor.author	Degrendele, Lieven
dc.contributor.author	Cauwe, Maarten
dc.contributor.author	Allaert, Bart
dc.contributor.author	Lauwaert, Ralph
dc.contributor.author	Willems, Geert
dc.contributor.imecauthor	Vandevelde, Bart
dc.contributor.imecauthor	Degrendele, Lieven
dc.contributor.imecauthor	Cauwe, Maarten
dc.contributor.imecauthor	Willems, Geert
dc.contributor.orcidimec	Vandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimec	Cauwe, Maarten::0000-0002-6413-998X
dc.contributor.orcidimec	Willems, Geert::0000-0002-9137-618X
dc.date.accessioned	2021-10-23T16:17:19Z
dc.date.available	2021-10-23T16:17:19Z
dc.date.embargo	9999-12-31
dc.date.issued	2016-04
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/27485
dc.identifier.url	http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7486790
dc.source.beginpage	94
dc.source.conference	International Conference on Electronics Packaging - ICEP
dc.source.conferencedate	20/04/2016
dc.source.conferencelocation	Sapporo Japan
dc.source.endpage	98
dc.title	How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance
dc.type	Proceedings paper
dspace.entity.type	Publication
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