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Four-point bending cycling as alternative for thermal cycling solder fatigue testing
Publication:
Four-point bending cycling as alternative for thermal cycling solder fatigue testing
Date
2016-04
Proceedings Paper
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33581.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vandevelde, Bart
;
Vanhee, Filip
;
Pissoort, Davy
;
Degrendele, Lieven
;
De Baets, Johan
;
Allaert, Bart
;
Lauwaert, Ralph
;
Labie, Riet
;
Willems, Geert
Journal
Abstract
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Views
1966
since deposited on 2021-10-23
Acq. date: 2025-10-26
Citations
Metrics
Views
1966
since deposited on 2021-10-23
Acq. date: 2025-10-26
Citations