Publication:

Four-point bending cycling as alternative for thermal cycling solder fatigue testing

Date

2016-04
Proceedings Paper
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dc.contributor.authorVandevelde, Bart
dc.contributor.authorVanhee, Filip
dc.contributor.authorPissoort, Davy
dc.contributor.authorDegrendele, Lieven
dc.contributor.authorDe Baets, Johan
dc.contributor.authorAllaert, Bart
dc.contributor.authorLauwaert, Ralph
dc.contributor.authorLabie, Riet
dc.contributor.authorWillems, Geert
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorDegrendele, Lieven
dc.contributor.imecauthorDe Baets, Johan
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorWillems, Geert
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecWillems, Geert::0000-0002-9137-618X
dc.date.accessioned2021-10-23T16:17:49Z
dc.date.available2021-10-23T16:17:49Z
dc.date.embargo9999-12-31
dc.date.issued2016-04
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27486
dc.source.conference17th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectr. and Microsyst. - EuroSimE
dc.source.conferencedate17/04/2016
dc.source.conferencelocationMontpellier France
dc.title

Four-point bending cycling as alternative for thermal cycling solder fatigue testing

dc.typeProceedings paper
dspace.entity.typePublication
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