Browsing by author "van Veen, Co"
Now showing items 1-2 of 2
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Finite element analysis of ultra thin BGA package: first and second level reliability
Limaye, Paresh; Vandevelde, Bart; de Vries, Hans; Degryse, Dominiek; Slob, Kees; van Veen, Co; Labie, Riet (2004-05) -
Influence of solder joint shape on the thermo-mechanical reliability of CSP's
van Veen, Co; Vandevelde, Bart; Beyne, Eric (2004)