Browsing by author "Wei, Jason"

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Electrically conductive adhesives: a real alternative to soldered intercommention?

Beaucarne, Guy; Campeol, Frederic; Young, Xue; Wei, Jason; Yu, Yanghai; Kuzma Filipek, Izabela; Russell, Richard; Duerinckx, Filip (2014)
Ribbon bonding on busbarless cells using Electrically Conductive Adhesives: potential and challenges

Beaucarne, Guy; Kuzma Filipek, Izabela; Campeol, Frederic; Russell, Richard; Young, Xue Yang; Wei, Jason; Yu, Yanghai; Duerinckx, Filip (2014)