Browsing by author "Vereecken, M."

Now showing items 1-2 of 2

Electroless nickel-gold stud bumping on laminate for flip-chip assembly

Zang, S.; Vereecken, M.; De Baets, J.; Van Calster, Andre; Vervaet, A.; Peeters, Joris; Allaert, K. (1997)
Investigation and characterisation of COB assembly aspects on high power MCM-L substrates

Ackaert, Ann; Vereecken, M.; Forrest, M.; Beyne, Eric; Van De Peer, Myriam (1994)