Browsing by author "Walsby, Edward"
Now showing items 1-5 of 5
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Demonstration of a collective hybrid die-to-wafer integration using glass carrier
Suhard, Samuel; Kennes, Koen; Bex, Pieter; Jourdain, Anne; Teugels, Lieve; Walsby, Edward; Bolton, Chris; Patel, Jash; Ashraf, Huma; Barnett, Richard; Fodor, Ferenc; Phommahaxay, Alain; La Tulipe, Douglas Charles; Beyer, Gerald; Beyne, Eric (2021) -
Direct Bonding Using Low Temperature SiCN Dielectrics
Iacovo, Serena; Nagano, Fuya; Channam, Venkat Sunil Kumar; Walsby, Edward; Crook, Kath; Buchanan, Keith; Jourdain, Anne; Vanstreels, Kris; Phommahaxay, Alain; Beyne, Eric (2022) -
Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous Integration
Jourdain, Anne; Schleicher, Filip; De Vos, Joeri; Stucchi, Michele; Chery, Emmanuel; Miller, Andy; Beyer, Gerald; Van der Plas, Geert; Walsby, Edward; Roberts, Kerry; Ashraf, Huma; Thomas, Dave; Beyne, Eric (2020) -
Low temperature SiCN as dielectric for hybrid bonding
Channam, Venkat Sunil Kumar; Iacovo, Serena; Walsby, Edward; Belov, Igor; Jourdain, Anne; Sepulveda Marquez, Alfonso; Beyne, Eric (2023) -
Vapor deposited thin organic-inorganic capping layers preventing copper line oxidation in polymer-based RDL technologies
Chery, Emmanuel; Brady-Boyd, Anita; Lin, Yuyuan; Grimes, Michael; Springer, David; Slabbekoorn, John; Walsby, Edward; Croes, Kristof; Beyne, Eric (2022-10-15)