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Low temperature SiCN as dielectric for hybrid bonding
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Authors
Channam, Venkat Sunil Kumar
;
Iacovo, Serena
;
Walsby, Edward
;
Belov, Igor
;
Jourdain, Anne
;
Sepulveda Marquez, Alfonso
;
Beyne, Eric
DOI
10.1109/EDTM55494.2023.10103036
EISBN
979-8-3503-3252-0
ISSN
2473-2001
Conference
7th IEEE Electron Devices Technology and Manufacturing Conference (EDTM)
Journal
N/A
Title
Low temperature SiCN as dielectric for hybrid bonding
Publication type
Proceedings paper
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Conference contributions
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Date
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3
20.500.12860/42453.3
*
2024-03-25T15:35:03Z
validation by library/open access desk
2
20.500.12860/42453.2
2023-09-07T09:48:12Z
validation by imec author
1
20.500.12860/42453
2023-09-03T17:38:49Z
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