Browsing by author "Beyne, Eric"

10 and 7 mu m Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process

Derakhshandeh, Jaber; Capuz, Giovanni; Cherman, Vladimir; Inoue, Fumihiro; De Preter, Inge; Hou, Lin; Bex, Pieter; Gerets, Carine; Duval, Fabrice; Webers, Tomas; Bertheau, Julien; Van Huylenbroeck, Stefaan; Phommahaxay, Alain; Shafahian, Ehsan; Van der Plas, Geert; Beyne, Eric; Miller, Andy; Beyer, Gerald (2020)

2D vs 3D integration: Architecture-technology co-design for future mobile MPSoC platforms

Agrawal, Prashant; Milojevic, Dragomir; Raghavan, Praveen; Catthoor, Francky; Van der Perre, Liesbet; Beyne, Eric; Varadarajan, Ravi (2014)

2x2 and 4x4 arrays of annular slot antennas in MCM-D technology fed by coplanar CPW networks

Soliman, Ezzeldin; Brebels, Steven; Beyne, Eric; Vandenbosch, G. A. E. (1999)

3-D technology assessment: path-finding the technology/design sweet-spot

Marchal, Pol; Bougard, Bruno; Katti, Guruprasad; Stucchi, Michele; Dehaene, Wim; Papanikolaou, Antonis; Verkest, Diederik; Swinnen, Bart; Beyne, Eric (2009)

300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications

Jourdain, Anne; Buisson, Thibault; Phommahaxay, Alain; Privett, Marc; Wallace, Daniel; Sood, Sumant; Bisson, Peter; Beyne, Eric; Travaly, Youssef; Swinnen, Bart (2010-11)

3D

Zhang, Wenqi; Limaye, Paresh; La Manna, Antonio; Beyne, Eric; Soussan, Philippe (2011)

3D chip package interaction thermo-mechanical challenges: proximity effects of through silicon vias and μ-bumps

Guo, Wei; Van der Plas, Geert; Ivankovic, Andrej; Eneman, Geert; Cherman, Vladimir; De Wachter, Bart; Mercha, Abdelkarim; Gonzalez, Mario; Civale, Yann; Redolfi, Augusto; Buisson, Thibault; Jourdain, Anne; Vandevelde, Bart; Rebibis, Kenneth June; De Wolf, Ingrid; La Manna, Antonio; Beyer, Gerald; Beyne, Eric; Swinnen, Bart (2012)

3D Embedding and interconnection of ultra thin (<20um) silicon dies

Iker, Francois; Sabuncuoglu Tezcan, Deniz; Cotrin Teixeira, Ricardo; Soussan, Philippe; De Moor, Piet; Beyne, Eric; Baert, Kris (2007)

3D heterogeneous integration techniques for wireless devices

De Raedt, Walter; Brebels, Steven; Soussan, Philippe; Beyne, Eric (2010)

3D Heterogeneous Package Integration of Air/Magnetic Core Inductor: 89%-Efficiency Buck Converter with Backside Power Delivery Network

Sun, Xiao; Lin, Hesheng; Velenis, Dimitrios; Slabbekoorn, John; Talmelli, Giacomo; Bex, Pieter; Sterken, Tom; Lauwereins, Rudy; Adelmann, Christoph; Miller, Andy; Van der Plas, Geert; Beyne, Eric (2020)

3D heterogeneous system integration: Application driver for 3D technology development

Beyne, Eric; Marchal, Pol; Van der Plas, Geert (2011)

3D IC assembly using thermal compression bonding and wafer-level underfill – strategies for quality improvement and throughput enhancement

Wang, Teng; Bex, Pieter; Capuz, Giovanni; Duval, Fabrice; Inoue, Fumihiro; Gerets, Carine; Bertheau, Julien; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric; Natsukawa, Masanori; Mitsukura, Kazuyuki; Hatakeyama, Keiichi (2016)