Publication:

3D integration challenges for fine pitch back side micro-bumping on ZoneBOND™ wafers

Date

2012
Proceedings Paper
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Author(s)

Buisson, Thibault
;
De Preter, Inge  
;
Suhard, Samuel  
;
Vandersmissen, Kevin  
;
Jaenen, Patrick  
;
Witters, Thomas  
;
Jamieson, Geraldine  
;
Jourdain, Anne  
;
Van Huylenbroeck, Stefaan  
;
La Manna, Antonio  
;
Beyer, Gerald  
;
Beyne, Eric  

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