3D integration challenges for fine pitch back side micro-bumping on ZoneBOND™ wafers

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Authors
Buisson, Thibault; De Preter, Inge; Suhard, Samuel; Vandersmissen, Kevin; Jaenen, Patrick; Witters, Thomas; Jamieson, Geraldine; Jourdain, Anne; Van Huylenbroeck, Stefaan; La Manna, Antonio; Beyer, Gerald; Beyne, Eric
Conference
4th Electronics System Integration Technologies Conference - ESTC
Title
3D integration challenges for fine pitch back side micro-bumping on ZoneBOND™ wafers
Publication type
Proceedings paper
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