Publication:

3D integration challenges for fine pitch back side micro-bumping on ZoneBOND™ wafers

Date

2012
Proceedings Paper
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dc.contributor.authorBuisson, Thibault
dc.contributor.authorDe Preter, Inge
dc.contributor.authorSuhard, Samuel
dc.contributor.authorVandersmissen, Kevin
dc.contributor.authorJaenen, Patrick
dc.contributor.authorWitters, Thomas
dc.contributor.authorJamieson, Geraldine
dc.contributor.authorJourdain, Anne
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorVandersmissen, Kevin
dc.contributor.imecauthorJaenen, Patrick
dc.contributor.imecauthorWitters, Thomas
dc.contributor.imecauthorJamieson, Geraldine
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecJamieson, Geraldine::0000-0002-6750-097X
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecWitters, Thomas::0000-0002-8528-9469
dc.contributor.orcidimecJourdain, Anne::0000-0002-7610-0513
dc.date.accessioned2021-10-20T10:10:17Z
dc.date.available2021-10-20T10:10:17Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20405
dc.source.conference4th Electronics System Integration Technologies Conference - ESTC
dc.source.conferencedate17/09/2012
dc.source.conferencelocationAmsterdam Netherlands
dc.title

3D integration challenges for fine pitch back side micro-bumping on ZoneBOND™ wafers

dc.typeProceedings paper
dspace.entity.typePublication
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