3D Embedding and interconnection of ultra thin (<20um) silicon dies

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Authors
Iker, Francois; Sabuncuoglu Tezcan, Deniz; Cotrin Teixeira, Ricardo; Soussan, Philippe; De Moor, Piet; Beyne, Eric; Baert, Kris
Conference
9th Electronics Packaging Technology Conference - EPTC
Title
3D Embedding and interconnection of ultra thin (<20um) silicon dies
Publication type
Proceedings paper
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