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3D Embedding and interconnection of ultra thin (<20um) silicon dies

Date

2007
Proceedings Paper
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dc.contributor.authorIker, Francois
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorCotrin Teixeira, Ricardo
dc.contributor.authorSoussan, Philippe
dc.contributor.authorDe Moor, Piet
dc.contributor.authorBeyne, Eric
dc.contributor.authorBaert, Kris
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-16T16:49:51Z
dc.date.available2021-10-16T16:49:51Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12334
dc.source.beginpage222
dc.source.conference9th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate10/12/2007
dc.source.conferencelocationSingapore
dc.source.endpage226
dc.title

3D Embedding and interconnection of ultra thin (<20um) silicon dies

dc.typeProceedings paper
dspace.entity.typePublication
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