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3D Embedding and interconnection of ultra thin (<20um) silicon dies
Publication:
3D Embedding and interconnection of ultra thin (<20um) silicon dies
Date
2007
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Iker, Francois
;
Sabuncuoglu Tezcan, Deniz
;
Cotrin Teixeira, Ricardo
;
Soussan, Philippe
;
De Moor, Piet
;
Beyne, Eric
;
Baert, Kris
Journal
Abstract
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1995
since deposited on 2021-10-16
Acq. date: 2025-10-23
Citations
Metrics
Views
1995
since deposited on 2021-10-16
Acq. date: 2025-10-23
Citations