Authors

Jourdain, Anne; Buisson, Thibault; Phommahaxay, Alain; Privett, Marc; Wallace, Daniel; Sood, Sumant; Bisson, Peter; Beyne, Eric; Travaly, Youssef; Swinnen, Bart

Conference

IEEE International 3D System Integration Conference - 3DIC

Title

300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications

Publication type

Meeting abstract