Publication:
300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications
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2108 since deposited on 2021-10-18
2last month
Acq. date: 2026-01-11
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Views
2108 since deposited on 2021-10-18
2last month
Acq. date: 2026-01-11
Citations