300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications

Publication:

2010

Meeting abstract

Author(s)

;

Buisson, Thibault

;

;

Privett, Marc

;

Wallace, Daniel

;

Sood, Sumant

;

Bisson, Peter

;

;

Travaly, Youssef

;

2119 since deposited on 2021-10-18

Acq. date: 2026-07-17