Publication:
300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications
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2118 since deposited on 2021-10-18
3last month
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Acq. date: 2026-04-27
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Statistics
Views
2118 since deposited on 2021-10-18
3last month
1last week
Acq. date: 2026-04-27
Citations