Publication:
300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications
Date
| dc.contributor.author | Jourdain, Anne | |
| dc.contributor.author | Buisson, Thibault | |
| dc.contributor.author | Phommahaxay, Alain | |
| dc.contributor.author | Privett, Marc | |
| dc.contributor.author | Wallace, Daniel | |
| dc.contributor.author | Sood, Sumant | |
| dc.contributor.author | Bisson, Peter | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | Travaly, Youssef | |
| dc.contributor.author | Swinnen, Bart | |
| dc.contributor.imecauthor | Jourdain, Anne | |
| dc.contributor.imecauthor | Phommahaxay, Alain | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.imecauthor | Swinnen, Bart | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-18T17:25:05Z | |
| dc.date.available | 2021-10-18T17:25:05Z | |
| dc.date.issued | 2010-11 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/17327 | |
| dc.source.conference | IEEE International 3D System Integration Conference - 3DIC | |
| dc.source.conferencedate | 16/11/2010 | |
| dc.source.conferencelocation | Munich Germany | |
| dc.title | 300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications | |
| dc.type | Meeting abstract | |
| dspace.entity.type | Publication | |
| Files | ||
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