Browsing by author "Beyne, Eric"
Now showing items 21-40 of 937
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3D integration, crossing IC technology, packaging and design barriers
Beyne, Eric (2008) -
3D Interconnect technology for space applications
De Moor, Piet; De Munck, Koen; Sabuncuoglu Tezcan, Deniz; Baert, Kris; Beyne, Eric; Van Hoof, Chris (2005) -
3D Interconnection and packaging: impending reality or still a dream?
Beyne, Eric (2004) -
3D interposer technology - challenges and opportunities
Beyne, Eric (2014) -
3D packaging - challenges
Beyne, Eric (2007) -
3D Packaging issues for ultrasmall systems-in-a-cube
Snoeckx, Koen; De Moor, Piet; De Munck, Koen; Beyne, Eric (2005-04) -
3D packaging technologies
Beyne, Eric (2008) -
3D packaging using organic laminates solutions
De Baets, Johan; Beyne, Eric (2007) -
3D printed liquid jet impingement cooler: Demonstration, opportunities and challenges
Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; De Wolf, Ingrid; Beyne, Eric; Yang, Shoufeng; Baelmans, Martine (2018) -
3D SoC integration, beyond 2.5D chiplets
Beyne, Eric; Milojevic, Dragomir; Van der Plas, Geert; Beyer, Gerald (2021) -
3D stacked IC demonstration using a through silicon via first approach
Van Olmen, Jan; Mercha, Abdelkarim; Katti, Guruprasad; Huyghebaert, Cedric; Van Aelst, Joke; Seppala, Emma; Zhao, Chao; Armini, Silvia; Vaes, Jan; Cotrin Teixeira, Ricardo; Van Cauwenberghe, Marc; Verdonck, Patrick; Verhemeldonck, Koen; Jourdain, Anne; Ruythooren, Wouter; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Chiarella, Thomas; Parvais, Bertrand; Debusschere, Ingrid; Hoffmann, Thomas Y.; De Wachter, Bart; Dehaene, Wim; Stucchi, Michele; Rakowski, Michal; Soussan, Philippe; Cartuyvels, Rudi; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2008) -
3D stacked IC demonstrator using hybrid collective die-to-wafer bonding with copper through silicon vias (TSV)
Van Olmen, Jan; Coenen, Jens; Dehaene, Wim; De Meyer, Kristin; Huyghebaert, Cedric; Jourdain, Anne; Katti, Guruprasad; Mercha, Abdelkarim; Rakowski, Michal; Stucchi, Michele; Travaly, Youssef; Beyne, Eric; Swinnen, Bart (2009) -
3D stacked ICs using Cu TSVs and die to wafer hybrid collective bonding
Katti, Guruprasad; Mercha, Abdelkarim; Van Olmen, Jan; Huyghebaert, Cedric; Jourdain, Anne; Stucchi, Michele; Rakowski, Michal; Debusschere, Ingrid; Soussan, Philippe; Dehaene, Wim; De Meyer, Kristin; Travaly, Youssef; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2009) -
3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures
De Preter, Inge; Derakhshandeh, Jaber; Nagano, Fuya; Houshmand Sharifi, Shamin; Hou, Lin; Bex, Pieter; Suhard, Samuel; Shibata, Toshiaki; Yukinori, Oda; Hashimoto, Shigeo; Lieten, Ruben; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2017) -
3D stacking heterogeneous integration for devices and modules
Sun, Xiao; De Raedt, Walter; Beyne, Eric (2012) -
3D stacking induced mechanical stress effects
Cherman, Vladimir; Van der Plas, Geert; De Vos, Joeri; Ivankovic, Andrej; Lofrano, Melina; Simons, Veerle; Gonzalez, Mario; Vanstreels, Kris; Wang, Teng; Daily, Robert; Guo, Wei; Beyer, Gerald; La Manna, Antonio; De Wolf, Ingrid; Beyne, Eric (2014) -
3D stacking of Co and Ni based microbumps
De Preter, Inge; Derakhshandeh, Jaber; Hou, Lin; Gerets, Carine; Wang, Teng; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2016) -
3D stacking using bump-less process for sub 10μm pitches
Derakhshandeh, Jaber; De Preter, Inge; Gerets, Carine; Hou, Lin; Heylen, Nancy; Beyne, Eric; Beyer, Gerald; Slabbekoorn, John; Dubey, Vikas; Jourdain, Anne; Potoms, Goedele; Inoue, Fumihiro; Jamieson, Geraldine; Vandersmissen, Kevin; Suhard, Samuel; Webers, Tomas; Capuz, Giovanni; Wang, Teng; Rebibis, Kenneth June; Miller, Andy (2016) -
3D stacking using Cu-Cu direct bonding
Hu, Yu-Hsiang; Liu, C.S.; Lii, M.J.; Rebibis, Kenneth June; Jourdain, Anne; La Manna, Antonio; Beyer, Gerald; Beyne, Eric; Yu, (2012-02) -
3D stacking using Cu-Cu direct bonding for 40μm pitch and beyond
Hu, Yu-Hsiang; Rebibis, Kenneth June; Zhao, Ming; La Manna, Antonio; Beyne, Eric; Liu, C.S.; Lii, M.J.; Yu, C.H. (2012)