3D stacking induced mechanical stress effects

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Authors
Cherman, Vladimir; Van der Plas, Geert; De Vos, Joeri; Ivankovic, Andrej; Lofrano, Melina; Simons, Veerle; Gonzalez, Mario; Vanstreels, Kris; Wang, Teng; Daily, Robert; Guo, Wei; Beyer, Gerald; La Manna, Antonio; De Wolf, Ingrid; Beyne, Eric
Conference
IEEE 64th Electronic Components and Technology Conference - ECTC
Title
3D stacking induced mechanical stress effects
Publication type
Proceedings paper
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