Publication:
3D stacking induced mechanical stress effects
Date
| dc.contributor.author | Cherman, Vladimir | |
| dc.contributor.author | Van der Plas, Geert | |
| dc.contributor.author | De Vos, Joeri | |
| dc.contributor.author | Ivankovic, Andrej | |
| dc.contributor.author | Lofrano, Melina | |
| dc.contributor.author | Simons, Veerle | |
| dc.contributor.author | Gonzalez, Mario | |
| dc.contributor.author | Vanstreels, Kris | |
| dc.contributor.author | Wang, Teng | |
| dc.contributor.author | Daily, Robert | |
| dc.contributor.author | Guo, Wei | |
| dc.contributor.author | Beyer, Gerald | |
| dc.contributor.author | La Manna, Antonio | |
| dc.contributor.author | De Wolf, Ingrid | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Cherman, Vladimir | |
| dc.contributor.imecauthor | Van der Plas, Geert | |
| dc.contributor.imecauthor | De Vos, Joeri | |
| dc.contributor.imecauthor | Lofrano, Melina | |
| dc.contributor.imecauthor | Simons, Veerle | |
| dc.contributor.imecauthor | Gonzalez, Mario | |
| dc.contributor.imecauthor | Vanstreels, Kris | |
| dc.contributor.imecauthor | Guo, Wei | |
| dc.contributor.imecauthor | Beyer, Gerald | |
| dc.contributor.imecauthor | La Manna, Antonio | |
| dc.contributor.imecauthor | De Wolf, Ingrid | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
| dc.contributor.orcidimec | De Vos, Joeri::0000-0002-9332-9336 | |
| dc.contributor.orcidimec | Simons, Veerle::0000-0001-5714-955X | |
| dc.contributor.orcidimec | Vanstreels, Kris::0000-0002-4420-0966 | |
| dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-22T00:56:44Z | |
| dc.date.available | 2021-10-22T00:56:44Z | |
| dc.date.issued | 2014 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/23641 | |
| dc.identifier.url | http://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6897304&contentType=Conference+Publications | |
| dc.source.beginpage | 309 | |
| dc.source.conference | IEEE 64th Electronic Components and Technology Conference - ECTC | |
| dc.source.conferencedate | 27/05/2014 | |
| dc.source.conferencelocation | Lake Buena Vista, FL USA | |
| dc.source.endpage | 315 | |
| dc.title | 3D stacking induced mechanical stress effects | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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