Authors

De Preter, Inge; Derakhshandeh, Jaber; Nagano, Fuya; Houshmand Sharifi, Shamin; Hou, Lin; Bex, Pieter; Suhard, Samuel; Shibata, Toshiaki; Yukinori, Oda; Hashimoto, Shigeo; Lieten, Ruben; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric

Conference

IEEE International Interconnect Technology Conference - IITC

Title

3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures

Publication type

Proceedings paper

Embargo date

9999-12-31