Publication:
3D stacked IC demonstrator using hybrid collective die-to-wafer bonding with copper through silicon vias (TSV)
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2033 since deposited on 2021-10-18
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Acq. date: 2025-10-25
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Views
2033 since deposited on 2021-10-18
453item.page.metrics.field.last-week
Acq. date: 2025-10-25
Citations