Publication:

3D stacked IC demonstrator using hybrid collective die-to-wafer bonding with copper through silicon vias (TSV)

Date

2009

Proceedings Paper

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Author(s)

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De Meyer, Kristin

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Huyghebaert, Cedric

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Katti, Guruprasad

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Mercha, Abdelkarim

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Rakowski, Michal

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Stucchi, Michele

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Travaly, Youssef

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