Publication:

3D stacked IC demonstrator using hybrid collective die-to-wafer bonding with copper through silicon vias (TSV)

Date

2009
Proceedings Paper
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dc.contributor.authorVan Olmen, Jan
dc.contributor.authorCoenen, Jens
dc.contributor.authorDehaene, Wim
dc.contributor.authorDe Meyer, Kristin
dc.contributor.authorHuyghebaert, Cedric
dc.contributor.authorJourdain, Anne
dc.contributor.authorKatti, Guruprasad
dc.contributor.authorMercha, Abdelkarim
dc.contributor.authorRakowski, Michal
dc.contributor.authorStucchi, Michele
dc.contributor.authorTravaly, Youssef
dc.contributor.authorBeyne, Eric
dc.contributor.authorSwinnen, Bart
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.imecauthorDehaene, Wim
dc.contributor.imecauthorDe Meyer, Kristin
dc.contributor.imecauthorHuyghebaert, Cedric
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorMercha, Abdelkarim
dc.contributor.imecauthorRakowski, Michal
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.orcidimecHuyghebaert, Cedric::0000-0001-6043-7130
dc.contributor.orcidimecMercha, Abdelkarim::0000-0002-2174-6958
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-18T04:18:17Z
dc.date.available2021-10-18T04:18:17Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16407
dc.source.conferenceIEEE 3D-IC
dc.source.conferencedate28/09/2009
dc.source.conferencelocationSan Francisco, CA USA
dc.title

3D stacked IC demonstrator using hybrid collective die-to-wafer bonding with copper through silicon vias (TSV)

dc.typeProceedings paper
dspace.entity.typePublication
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