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3D stacked IC demonstration using a through silicon via first approach
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Authors
Van Olmen, Jan
;
Mercha, Abdelkarim
;
Katti, Guruprasad
;
Huyghebaert, Cedric
;
Van Aelst, Joke
;
Seppala, Emma
;
Zhao, Chao
;
Armini, Silvia
;
Vaes, Jan
;
Cotrin Teixeira, Ricardo
;
Van Cauwenberghe, Marc
;
Verdonck, Patrick
;
Verhemeldonck, Koen
;
Jourdain, Anne
;
Ruythooren, Wouter
;
de Potter de ten Broeck, Muriel
;
Opdebeeck, Ann
;
Chiarella, Thomas
;
Parvais, Bertrand
;
Debusschere, Ingrid
;
Hoffmann, Thomas Y.
;
De Wachter, Bart
;
Dehaene, Wim
;
Stucchi, Michele
;
Rakowski, Michal
;
Soussan, Philippe
;
Cartuyvels, Rudi
;
Beyne, Eric
;
Biesemans, Serge
;
Swinnen, Bart
Conference
Technical Digest International Electron Devices Meeting - IEDM
Title
3D stacked IC demonstration using a through silicon via first approach
Publication type
Proceedings paper
Embargo date
9999-12-31
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