Publication:

3D stacked IC demonstration using a through silicon via first approach

Date

2008
Proceedings Paper
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dc.contributor.authorVan Olmen, Jan
dc.contributor.authorMercha, Abdelkarim
dc.contributor.authorKatti, Guruprasad
dc.contributor.authorHuyghebaert, Cedric
dc.contributor.authorVan Aelst, Joke
dc.contributor.authorSeppala, Emma
dc.contributor.authorZhao, Chao
dc.contributor.authorArmini, Silvia
dc.contributor.authorVaes, Jan
dc.contributor.authorCotrin Teixeira, Ricardo
dc.contributor.authorVan Cauwenberghe, Marc
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorVerhemeldonck, Koen
dc.contributor.authorJourdain, Anne
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorde Potter de ten Broeck, Muriel
dc.contributor.authorOpdebeeck, Ann
dc.contributor.authorChiarella, Thomas
dc.contributor.authorParvais, Bertrand
dc.contributor.authorDebusschere, Ingrid
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.imecauthorMercha, Abdelkarim
dc.contributor.imecauthorHuyghebaert, Cedric
dc.contributor.imecauthorVan Aelst, Joke
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorVan Cauwenberghe, Marc
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorVerhemeldonck, Koen
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorde Potter de ten Broeck, Muriel
dc.contributor.imecauthorOpdebeeck, Ann
dc.contributor.imecauthorChiarella, Thomas
dc.contributor.imecauthorParvais, Bertrand
dc.contributor.imecauthorDebusschere, Ingrid
dc.contributor.imecauthorDe Wachter, Bart
dc.contributor.imecauthorDehaene, Wim
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorRakowski, Michal
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.orcidimecMercha, Abdelkarim::0000-0002-2174-6958
dc.contributor.orcidimecHuyghebaert, Cedric::0000-0001-6043-7130
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.contributor.orcidimecChiarella, Thomas::0000-0002-6155-9030
dc.contributor.orcidimecParvais, Bertrand::0000-0003-0769-7069
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-17T12:00:57Z
dc.date.available2021-10-17T12:00:57Z
dc.date.embargo9999-12-31
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14674
dc.source.beginpage603
dc.source.conferenceTechnical Digest International Electron Devices Meeting - IEDM
dc.source.conferencedate15/12/2008
dc.source.conferencelocationSan Francisco, CA USA
dc.source.endpage606
dc.title

3D stacked IC demonstration using a through silicon via first approach

dc.typeProceedings paper
dspace.entity.typePublication
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