3D stacking using Cu-Cu direct bonding for 40μm pitch and beyond

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Authors
Hu, Yu-Hsiang; Rebibis, Kenneth June; Zhao, Ming; La Manna, Antonio; Beyne, Eric; Liu, C.S.; Lii, M.J.; Yu, C.H.
Conference
4th Electronics System Integration Technologies Conference - ESTC
Title
3D stacking using Cu-Cu direct bonding for 40μm pitch and beyond
Publication type
Proceedings paper
Embargo date
9999-12-31
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