Publication:

3D stacking using Cu-Cu direct bonding for 40μm pitch and beyond

Date

2012
Proceedings Paper
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dc.contributor.authorHu, Yu-Hsiang
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorZhao, Ming
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorBeyne, Eric
dc.contributor.authorLiu, C.S.
dc.contributor.authorLii, M.J.
dc.contributor.authorYu, C.H.
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorZhao, Ming
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecZhao, Ming::0000-0002-0856-851X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-20T11:42:46Z
dc.date.available2021-10-20T11:42:46Z
dc.date.embargo9999-12-31
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20830
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6542096&queryText%3D3D+stacking+using+Cu-Cu+direct+bonding+for+40
dc.source.conference4th Electronics System Integration Technologies Conference - ESTC
dc.source.conferencedate17/09/2012
dc.source.conferencelocationAmsterdam The Netherlands
dc.title

3D stacking using Cu-Cu direct bonding for 40μm pitch and beyond

dc.typeProceedings paper
dspace.entity.typePublication
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