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Conference contributions
3D stacking heterogeneous integration for devices and modules
Publication:
3D stacking heterogeneous integration for devices and modules
Date
2012
Proceedings Paper
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24356.pdf
284.41 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Sun, Xiao
;
De Raedt, Walter
;
Beyne, Eric
Journal
Abstract
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1919
since deposited on 2021-10-20
Acq. date: 2025-10-29
Citations
Metrics
Views
1919
since deposited on 2021-10-20
Acq. date: 2025-10-29
Citations