Publication:

3D stacked ICs using Cu TSVs and die to wafer hybrid collective bonding

Date

2009
Proceedings Paper
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Author(s)

Katti, Guruprasad
;
Mercha, Abdelkarim  
;
Van Olmen, Jan  
;
Huyghebaert, Cedric  
;
Jourdain, Anne  
;
Stucchi, Michele  
;
Rakowski, Michal  
;
Debusschere, Ingrid  
;
Soussan, Philippe  
;
Dehaene, Wim  
;
De Meyer, Kristin  
;
Travaly, Youssef
;
Beyne, Eric  
;
Biesemans, Serge  
;
Swinnen, Bart  

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