Publication:

3D stacked ICs using Cu TSVs and die to wafer hybrid collective bonding

Date

2009
Proceedings Paper
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dc.contributor.authorKatti, Guruprasad
dc.contributor.authorMercha, Abdelkarim
dc.contributor.authorVan Olmen, Jan
dc.contributor.authorHuyghebaert, Cedric
dc.contributor.authorJourdain, Anne
dc.contributor.authorStucchi, Michele
dc.contributor.authorRakowski, Michal
dc.contributor.authorDebusschere, Ingrid
dc.contributor.authorSoussan, Philippe
dc.contributor.authorDehaene, Wim
dc.contributor.authorDe Meyer, Kristin
dc.contributor.authorTravaly, Youssef
dc.contributor.authorBeyne, Eric
dc.contributor.authorBiesemans, Serge
dc.contributor.authorSwinnen, Bart
dc.contributor.imecauthorMercha, Abdelkarim
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.imecauthorHuyghebaert, Cedric
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorRakowski, Michal
dc.contributor.imecauthorDebusschere, Ingrid
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorDehaene, Wim
dc.contributor.imecauthorDe Meyer, Kristin
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorBiesemans, Serge
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.orcidimecMercha, Abdelkarim::0000-0002-2174-6958
dc.contributor.orcidimecHuyghebaert, Cedric::0000-0001-6043-7130
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-17T23:20:10Z
dc.date.available2021-10-17T23:20:10Z
dc.date.embargo9999-12-31
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15572
dc.source.beginpage357
dc.source.conferenceIEEE International Electron Devices Meeting - IEDM
dc.source.conferencedate7/12/2009
dc.source.conferencelocationBaltimore, MD USA
dc.source.endpage360
dc.title

3D stacked ICs using Cu TSVs and die to wafer hybrid collective bonding

dc.typeProceedings paper
dspace.entity.typePublication
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