3D stacking using bump-less process for sub 10μm pitches

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Authors
Derakhshandeh, Jaber; De Preter, Inge; Gerets, Carine; Hou, Lin; Heylen, Nancy; Beyne, Eric; Beyer, Gerald; Slabbekoorn, John; Dubey, Vikas; Jourdain, Anne; Potoms, Goedele; Inoue, Fumihiro; Jamieson, Geraldine; Vandersmissen, Kevin; Suhard, Samuel; Webers, Tomas; Capuz, Giovanni; Wang, Teng; Rebibis, Kenneth June; Miller, Andy
Conference
IEEE 66th Electronic Components and Technology Conference - ECTC
Title
3D stacking using bump-less process for sub 10μm pitches
Publication type
Proceedings paper
Embargo date
9999-12-31
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