Publication:

3D stacking using bump-less process for sub 10μm pitches

Date

2016
Proceedings Paper
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dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorDe Preter, Inge
dc.contributor.authorGerets, Carine
dc.contributor.authorHou, Lin
dc.contributor.authorHeylen, Nancy
dc.contributor.authorBeyne, Eric
dc.contributor.authorBeyer, Gerald
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorDubey, Vikas
dc.contributor.authorJourdain, Anne
dc.contributor.authorPotoms, Goedele
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorJamieson, Geraldine
dc.contributor.authorVandersmissen, Kevin
dc.contributor.authorSuhard, Samuel
dc.contributor.authorWebers, Tomas
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorWang, Teng
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorHou, Lin
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorPotoms, Goedele
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorJamieson, Geraldine
dc.contributor.imecauthorVandersmissen, Kevin
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorWebers, Tomas
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecJamieson, Geraldine::0000-0002-6750-097X
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecJourdain, Anne::0000-0002-7610-0513
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.date.accessioned2021-10-23T10:32:48Z
dc.date.available2021-10-23T10:32:48Z
dc.date.embargo9999-12-31
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26537
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7545422/
dc.source.beginpage128
dc.source.conferenceIEEE 66th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate31/05/2016
dc.source.conferencelocationLake Buena Vista, FL USA
dc.source.endpage133
dc.title

3D stacking using bump-less process for sub 10μm pitches

dc.typeProceedings paper
dspace.entity.typePublication
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