Browsing by author "Beyne, Eric"
Now showing items 41-60 of 938
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3D stacking using ultra thin dies
La Manna, Antonio; Velenis, Dimitrios; Buisson, Thibault; Detalle, Mikael; Rebibis, Kenneth June; Zhang, Wenqi; Beyne, Eric (2012) -
3D system integration - mitigating the impact on CMOS devices
Beyne, Eric (2014) -
3D system integration - opportunities and challenges
Beyne, Eric (2010-12) -
3D system integration - opportunities and challenges
Zhang, Wenqi; Beyne, Eric (2011) -
3D system integration - opportunities and challenges in the supply chain
Beyne, Eric (2010) -
3D system integration and interconnect hierarchy: definitions and technology trends
Beyne, Eric (2009) -
3D system integration challenges and opportunities
Beyne, Eric (2008) -
3D system integration research at IMEC
Beyne, Eric (2015) -
3D system integration technologies
Beyne, Eric; Swinnen, Bart (2007) -
3D system integration technology
Beyne, Eric (2014) -
3D system integration technology convergence, progress and challenges
Beyne, Eric (2011) -
3D system integration: interconnect requirements and processes
Beyne, Eric (2010) -
3D technology enabling innovative smart system integration
Beyne, Eric; Zhang, Wenqi (2011) -
3D technology roadmap and status
Marchal, Pol; Van der Plas, Geert; Eneman, Geert; Moroz, V.; Badaroglu, Mustafa; Mercha, Abdelkarim; Thijs, Steven; Linten, Dimitri; Katti, Guruprasad; Stucchi, Michele; Vandevelde, Bart; Oprins, Herman; Cherman, Vladimir; Croes, Kris; Redolfi, Augusto; La Manna, Antonio; Travaly, Youssef; Beyne, Eric; Cartuyvels, Rudi (2011) -
3D technology – enabling innovative smart systems
Beyne, Eric (2011) -
3D technology – enabling innovative smart systems
Beyne, Eric (2011) -
3D Wafer level packaging: processes and materials for through silicon-vias and thin die embedding
Soussan, Philippe; Sabuncuoglu Tezcan, Deniz; Iker, Francois; Ruythooren, Wouter; Swinnen, Bart; Majeed, Bivragh; Beyne, Eric (2009) -
3D wafer-level packaging die stacking using spin-on-dielectric polymer liner through-silicon vias
Civale, Yann; Sabuncuoglu Tezcan, Deniz; Philipsen, Harold; Duval, Fabrice; Jaenen, Patrick; Travaly, Youssef; Soussan, Philippe; Swinnen, Bart; Beyne, Eric (2011) -
3D Wafer-to-Wafer Bonding Thermal Resistance Comparison: Hybrid Cu/dielectric Bonding versus Dielectric via-last Bonding
Oprins, Herman; Cherman, Vladimir; Webers, Tomas; Kim, Soon-Wook; de Vos, Joeri; Van der Plas, Geert; Beyne, Eric (2020)