EISBN
978-1-7281-9764-7
ISSN
1936-3958
Conference
19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Journal
na
Title
3D Wafer-to-Wafer Bonding Thermal Resistance Comparison: Hybrid Cu/dielectric Bonding versus Dielectric via-last Bonding
Publication type
Proceedings paper