Browsing by author "Oprins, Herman"
Now showing items 1-20 of 127
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3 omega correction method for eliminating resistance measurement error due to Joule heating
Guralnik, Benny; Hansen, Ole; Henrichsen, Henrik H.; Beltran-Pitarch, Braulio; osterberg, Frederik W.; Shiv, Lior; Marangoni, Thomas A.; Stilling-Andersen, Andreas R.; Cagliani, Alberto; Hansen, Mikkel F.; Nielsen, Peter F.; Oprins, Herman; Vermeersch, Bjorn; Adelmann, Christoph; Dutta, Shibesh; Borup, Kasper A.; Mihiretie, Besira M.; Petersen, Dirch H. (2021) -
3D Integration: Circuit design, test and reliability challenges
Minas, Nikolaos; De Wolf, Ingrid; Marinissen, Erik Jan; Stucchi, Michele; Oprins, Herman; Mercha, Abdelkarim; Van der Plas, Geert; Velenis, Dimitrios; Marchal, Pol (2010) -
3D printed liquid jet impingement cooler: Demonstration, opportunities and challenges
Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; De Wolf, Ingrid; Beyne, Eric; Yang, Shoufeng; Baelmans, Martine (2018) -
3D technology roadmap and status
Marchal, Pol; Van der Plas, Geert; Eneman, Geert; Moroz, V.; Badaroglu, Mustafa; Mercha, Abdelkarim; Thijs, Steven; Linten, Dimitri; Katti, Guruprasad; Stucchi, Michele; Vandevelde, Bart; Oprins, Herman; Cherman, Vladimir; Croes, Kris; Redolfi, Augusto; La Manna, Antonio; Travaly, Youssef; Beyne, Eric; Cartuyvels, Rudi (2011) -
3D thermal model with high spatial and temporal resolution
Dubey, Vikas; Govaerts, Jonathan; Catthoor, Francky; Oprins, Herman; Chatterjee, Urmimala; Lefevre, B.; Baert, Kris (2012) -
3D thermal modeling for a photovoltaic module
Chatterjee, Urmimala; Catthoor, Francky; Appels, Reinhart; Oprins, Herman; Van Wichelen, Koen; Vandevelde, Bart; Driesen, Johan; Baert, Kris (2011) -
3D Wafer-to-Wafer Bonding Thermal Resistance Comparison: Hybrid Cu/dielectric Bonding versus Dielectric via-last Bonding
Oprins, Herman; Cherman, Vladimir; Webers, Tomas; Kim, Soon-Wook; de Vos, Joeri; Van der Plas, Geert; Beyne, Eric (2020) -
3D-convolution based fast transient thermal model for 3D integrated circuits: methodology and applications
Maggioni, Federica; Oprins, Herman; Milojevic, Dragomir; Beyne, Eric; De Wolf, Ingrid; Baelmans, Martine (2015) -
A cold shower for chips
Oprins, Herman; Wei, Tiwei; Cherman, Vladimir; Beyne, Eric (2018-12) -
A Critical Analysis of the Thermo-Optic Time Constant in Si Photonic Devices
Coenen, David; Kim, Minkyu; Oprins, Herman; Van Campenhout, Joris; De Wolf, Ingrid (2024) -
A modeling and experimental method for accurate thermal analysis of AlGan/GaN HEMT power-bars
Sodan, Vice; Stoffels, Steve; Oprins, Herman; Baelmans, Martine; Decoutere, Stefaan; De Wolf, Ingrid (2015) -
A practical approach to thermal modeling and validation of 3D-ICs
Cupak, Miroslav; Oprins, Herman; Van der Plas, Geert; Marchal, Pol; Vandevelde, Bart; Srinivasan, Adi; Cheng, Edmund (2010) -
Advanced (Metal 3D-Printed) Direct Liquid Jet-Impingement Cooling Solution for Autonomous Driving High-Performance Vehicle Computer (HPVC)
Pappaterra, Antonio; Vandevelde, Bart; Nazemi, Majid; Verleysen, Willem; Oprins, Herman (2021) -
AlGaN/GaN HEMTs on Si substrates: Can they overcome the thermal limit?
Das, Jo; Oprins, Herman; Derluyn, Joff; Germain, Marianne; Borghs, Gustaaf (2007-05) -
Analysis of Thermal Crosstalk in Photonic Integrated Circuit Using Dynamic Compact Models
Coenen, David; Oprins, Herman; De Heyn, Peter; Van Campenhout, Joris; De Wolf, Ingrid (2022-08-03) -
Benchmarking of Machine Learning Methods for Multiscale Thermal Simulation of Integrated Circuits
Coenen, David; Oprins, Herman; Degraeve, Robin; De Wolf, Ingrid (2023) -
Calibrated fast thermal calculation and experimental characterization of advanced BEOL stacks
Chang, Xinyue; Oprins, Herman; Lofrano, Melina; Cherman, Vladimir; Vermeersch, Bjorn; Diaz Fortuny, Javier; Park, Seongho; Tokei, Zsolt; De Wolf, Ingrid (2023) -
Characterization and benchmarking of the low inter-tier thermal resistance of 3D hybrid Cu/dielectric wafer-to-wafer bonding
Oprins, Herman; Cherman, Vladimir; Webers, Tomas; Salahouelhadj, Abdellah; Kim, Soon-Wook; Peng, Lan; Van der Plas, Geert; Beyne, Eric (2017-03) -
Characterization of the thermal impact of Cu-Cu bonds achieved using TSVs on hot spot dissipation in 3D stacked ICs
Oprins, Herman; Cherman, Vladimir; Vandevelde, Bart; Torregiani, Cristina; Stucchi, Michele; Van der Plas, Geert; Marchal, Pol; Beyne, Eric (2011-05) -
Compact thermal modeling of hot spots in advanced 3D-stacked structures
Torregiani, Cristina; Oprins, Herman; Vandevelde, Bart; Beyne, Eric; De Wolf, Ingrid (2009)