Publication:
Characterization and benchmarking of the low inter-tier thermal resistance of 3D hybrid Cu/dielectric wafer-to-wafer bonding
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1938 since deposited on 2021-10-24
Acq. date: 2025-10-27
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Views
1938 since deposited on 2021-10-24
Acq. date: 2025-10-27
Citations