Authors

Oprins, Herman; Cherman, Vladimir; Webers, Tomas; Salahouelhadj, Abdellah; Kim, Soon-Wook; Peng, Lan; Van der Plas, Geert; Beyne, Eric

DOI

10.1115/1.4035597

ISSN

1043-7398

Issue

1

Journal

Journal of Electronic Packaging

Volume

139

Title

Characterization and benchmarking of the low inter-tier thermal resistance of 3D hybrid Cu/dielectric wafer-to-wafer bonding

Publication type

Journal article

Embargo date

9999-12-31