Publication:

Characterization and benchmarking of the low inter-tier thermal resistance of 3D hybrid Cu/dielectric wafer-to-wafer bonding

Date

2017-03
Journal article
https://doi.org/10.1115/1.4035597
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dc.contributor.authorOprins, Herman
dc.contributor.authorCherman, Vladimir
dc.contributor.authorWebers, Tomas
dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorKim, Soon-Wook
dc.contributor.authorPeng, Lan
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorWebers, Tomas
dc.contributor.imecauthorSalahouelhadj, Abdellah
dc.contributor.imecauthorKim, Soon-Wook
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecSalahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-24T10:29:47Z
dc.date.available2021-10-24T10:29:47Z
dc.date.embargo9999-12-31
dc.date.issued2017-03
dc.identifier.doi10.1115/1.4035597
dc.identifier.issn1043-7398
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/29118
dc.identifier.urlhttp://electronicpackaging.asmedigitalcollection.asme.org/article.aspx?articleID=2596186
dc.source.beginpage11008
dc.source.endpage011008-9
dc.source.issue1
dc.source.journalJournal of Electronic Packaging
dc.source.volume139
dc.title

Characterization and benchmarking of the low inter-tier thermal resistance of 3D hybrid Cu/dielectric wafer-to-wafer bonding

dc.typeJournal article
dspace.entity.typePublication
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