Characterization and benchmarking of the low inter-tier thermal resistance of 3D hybrid Cu/dielectric wafer-to-wafer bonding

Publication:

2017

Journal article

Author(s)

;

;

;

;

;

;

;

Journal of Electronic Packaging

1964 since deposited on 2021-10-24

10last month

1last week

Acq. date: 2026-09-16