Authors

Oprins, Herman; Cherman, Vladimir; Vandevelde, Bart; Torregiani, Cristina; Stucchi, Michele; Van der Plas, Geert; Marchal, Pol; Beyne, Eric

Conference

61st Electronic Components and Technology Conference - ECTC

Title

Characterization of the thermal impact of Cu-Cu bonds achieved using TSVs on hot spot dissipation in 3D stacked ICs

Publication type

Proceedings paper